The electronic products need heat dissipation during operation. Therefore, in the design of PCB circuit schematic diagram, special attention should be paid to thermal design. Once the design is improper, it will have a negative impact on electronic products. Now  introduce what rules should be followed for the thermal design of PCBA circuit board?

1. From the perspective of facilitating heat dissipation, it is recommended that PCB boards be installed vertically, and the spacing between boards should be more than two centimeters
2. For equipment cooled by free convection air, it is better to arrange the integrated circuits in the longitudinal way; For the equipment with forced air cooling, it is better to arrange the integrated circuits in horizontal length:
3. The components on the same PCB shall be arranged in zones as far as possible according to their calorific value and heat dissipation degree: components with low calorific value or poor heat resistance (such as small signal transistors) shall be placed at the top of the cooling air flow; Devices with high heat generation or good heat resistance (such as power transistors) are placed at the downstream of the cooling air flow.
4. In the horizontal direction, high-power devices are arranged as close to the edge of PCB as possible to shorten the heat transfer path; In the vertical direction, high-power devices shall be arranged as close as possible to the top of the PCB circuit board to reduce the impact of the device operation on the temperature of other devices.
5. The multiple devices should be staggered on the horizontal plane, and the devices sensitive to temperature should be placed in the area with the lowest temperature.
6. Reasonably configure components or printed circuit boards to avoid leaving a large space in a certain area.
7. The temperature of the printed circuit can be effectively reduced by using a reasonable device arrangement.