In the process of PCBA processing, due to the reason of circuit board, the difficulty of PCBA welding process and welding defects are often increased. Now let  introduce the requirements of PCBA processing for circuit board:

1. PCB edge width
The width of plate edge is greater than 5mm, the space between panels is less than 8mm, and the distance between pad and plate edge is greater than 5mm.

2. PCB pad
There is no through hole on the bonding pad of SMD components. If there is a through hole, the solder paste will flow into the hole, resulting in less tin in the device, or the tin will flow to the other side, resulting in uneven board surface, and the solder paste cannot be printed.

3. PCB size
PCB width (including board edge) shall be greater than or equal to 50 mm and less than 460 mm, and PCB length (including board edge) shall be greater than or equal to 50 mm. If the size is too small, it shall be made into a panel.

4. PCB bending
The upward bending degree is less than 1.2mm, and the downward bending degree is less than 0.5mm. PCB twist: maximum deformation height ÷ diagonal length<0.25mm.

5. Mark point of PCB
Mark's shape: standard circle, square, triangle;
Mark size: 0.8~1.5mm;
Mark's material: gold plating, tin plating, copper platinum;
Mark's surface requirements: the surface is flat, smooth, free of oxidation and dirt;
Mark's surrounding requirements: there shall be no green oil or other obstacles within 1mm around, which is obviously different from Mark's color;
Mark position: more than 3mm from the edge of the plate, and no holes or test points similar to Mark shall be found within 5mm around.